EP2C35F484I6N vs EP2C35F484C8N Comparación
Comparación detallada lado a lado de EP2C35F484I6N por Intel y EP2C35F484C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2C35F484I6N | EP2C35F484C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $52,10 | $65,00 |
| Logic Elements | 33,216 | 33,216 |
| Logic Array Blocks (LABs) | 2,100 | — |
| Total RAM Bits | 483,840 bits (483.84 Kbit on-chip) | — |
| Embedded 18x18 Multipliers | 35 (Cyclone II family maximum 150) | — |
| Phase-Locked Loops (PLLs) | 4 | — |
| Maximum User I/O Pins | 322 (package-dependent; FBGA-484 supports up to 322 user I/O) | — |
| Encapsulado | 484-ball FBGA (Fine-Pitch BGA) | 484-pin FBGA (FineLine BGA) |
| Logic Family | CMOS | — |
| Core Supply Voltage | 1.2 V | — |
| Rango de temperatura de funcionamiento | -40C to +85C (industrial) | — |
| Maximum Internal Clock Frequency | 402.5 MHz | — |
| Process Node | 90 nm TSMC CMOS | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Configuration Method | Serial / Parallel (via Altera/Intel configuration device or JTAG) | — |
| Family | — | Cyclone II |
| Embedded Memory (M4K blocks) | — | 105 blocks |
| Embedded Memory Bits | — | 483,840 bits |
| User I/Os | — | 322 |
| Embedded Multipliers (18x18) | — | 35 |
| PLLs | — | 4 |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Voltage (VCCIO) | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V (bank-dependent) |
| Process Technology | — | 90 nm |
| Temperatura de funcionamiento | — | 0C to +85C (commercial) |
| Speed Grade | — | 8 |
| Maximum Internal Frequency | — | 402.58 MHz |