EP2C50F672C8 vs EP2C50F672C7N Comparación
Comparación detallada lado a lado de EP2C50F672C8 por Intel y EP2C50F672C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2C50F672C8 | EP2C50F672C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $155,40 | $162,80 |
| Family | Cyclone II | Cyclone II |
| Logic Elements (LE) | 50,528 | — |
| Configurable Logic Blocks (CLBs / LABs) | 3,158 | — |
| Embedded Memory (M4K blocks) | 594 Kbits (129 M4K blocks) | — |
| Embedded Multipliers (18x18) | 86 | — |
| Phase-Locked Loops (PLLs) | 4 | — |
| Maximum User I/O Pins | 450 | — |
| Global Clock Networks | 16 | — |
| Process Technology | 90 nm CMOS, 1.2 V core | 90 nm |
| Maximum Internal Frequency | 402.58 MHz | 402.58 MHz |
| Temperatura de funcionamiento | 0 °C to +85 °C (commercial) | — |
| Encapsulado | 672-pin FBGA (FineLine BGA), 27 x 27 mm | 672-BGA (FBGA) |
| Speed Grade | 8 | 7 |
| Configuration Mode | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) | — |
| Tipo de montaje | Surface Mount, BGA | Surface Mount |
| Nivel MSL | 3 (168 hours) | — |
| Estado RoHS | Compliant (lead-free FBGA) | Compliant |
| Logic Elements | — | 50,528 |
| Total RAM Bits | — | 594,432 |
| Embedded Memory | — | 594 Kbit (M4K blocks) |
| Number of Logic Array Blocks (LABs) | — | [DATA_NEEDED: LAB count] |
| Number of I/O Pins | — | 450 |
| Number of Multipliers (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Number of PLLs | — | [DATA_NEEDED: PLL count] |
| Core Voltage | — | 1.2 V |
| Operating Temperature Grade | — | Commercial (C) |
| Programming Toolchain | — | Quartus II / Quartus Prime |