EP2C70F672C7N vs EP2C70F672C7 Comparación
Comparación detallada lado a lado de EP2C70F672C7N por Intel y EP2C70F672C7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2C70F672C7N | EP2C70F672C7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $195,00 | $278,00 |
| Family | Cyclone II | Cyclone II |
| Logic Elements (LE) | 68,416 | — |
| Total Memory Bits | 1,152,000 | — |
| Embedded Multipliers (18x18) | 150 | — |
| Maximum User I/O | 422 | 422 |
| User I/O Banks | 8 | — |
| PLLs | 4 | 4 |
| Encapsulado | 672-BGA (FBGA-672) | 672-ball FineLine BGA (FBGA-672) |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Temperatura de funcionamiento | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Speed Grade | C7 (slower, lower-power variant) | — |
| Supply Voltage - Core | 1.15 V to 1.25 V (internal) | — |
| Supply Voltage - I/O | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-standard) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant (lead-free FBGA) | Compliant |
| Nivel MSL | 3 (per JEDEC J-STD-020) | — |
| Configuration Method | Serial (AS) or Parallel (PS) via Altera EPCS/EPC configuration devices | — |
| Logic Elements | — | 68,416 |
| Configurable Logic Blocks (CLBs) | — | 4,276 LABs |
| Embedded Memory Bits | — | 1,152,000 bits (1152 Kbit) |
| Embedded 18x18 Multipliers | — | 150 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Auxiliary Voltage (VCCAUX) | — | 2.5 V |
| Internal Frequency | — | Up to 500 MHz |
| Configuration Modes | — | Passive Serial, Active Serial, JTAG |
| Lead Free | — | Yes |