EP2C70F896C6 vs EP2C70F672C7N Comparación
Comparación detallada lado a lado de EP2C70F896C6 por Intel y EP2C70F672C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2C70F896C6 | EP2C70F672C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $650,00 | $195,00 |
| Family | Cyclone II | Cyclone II |
| Logic Elements | 68,416 | — |
| Total Memory Bits | 1,152,000 | 1,152,000 |
| M9K Memory Blocks | 622 | — |
| Embedded 18x18 Multipliers | 150 | — |
| PLLs | 4 | 4 |
| Maximum User I/O | 622 (per DigiKey listing) | 422 |
| Maximum Operating Frequency | 500 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Voltage | 1.2 V | — |
| Encapsulado | 896-ball FBGA (FineLine BGA) | 672-BGA (FBGA-672) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Configuration Modes | Active Serial, Passive Serial, JTAG | — |
| Operating Temperature Grade | Commercial (0C to +85C) inferred from speed grade suffix | — |
| Speed Grade | 6 | C7 (slower, lower-power variant) |
| Estado RoHS | [DATA_NEEDED: confirmed RoHS compliance status] | Compliant (lead-free FBGA) |
| Logic Elements (LE) | — | 68,416 |
| Embedded Multipliers (18x18) | — | 150 |
| User I/O Banks | — | 8 |
| Temperatura de funcionamiento | — | 0C to +85C (Commercial) |
| Supply Voltage - Core | — | 1.15 V to 1.25 V (internal) |
| Supply Voltage - I/O | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-standard) |
| Nivel MSL | — | 3 (per JEDEC J-STD-020) |
| Configuration Method | — | Serial (AS) or Parallel (PS) via Altera EPCS/EPC configuration devices |