EP2C8AF256I8N vs EP2C5AF256I8N Comparación
Comparación detallada lado a lado de EP2C8AF256I8N por Intel y EP2C5AF256I8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2C8AF256I8N | EP2C5AF256I8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $21,40 | $16,10 |
| Family | Cyclone II | Cyclone II |
| Logic Elements (LE) | 8,256 | — |
| Embedded Memory Bits | 165,888 bits (162 Kbit RAM) | — |
| Embedded Multipliers (18x18) | 36 | 13 |
| Maximum User I/O Pins | 182 | — |
| PLLs | 4 | 4 |
| Global Clocks | 16 | — |
| Configuration Elements | Embedded SRAM, JTAG, AS, PS | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-selectable) | — |
| Process Technology | 90 nm CMOS, SRAM-based | 90 nm |
| Encapsulado | 256-ball FBGA (FineLine BGA) | 256-LBGA (FBGA), 17 mm body |
| Temperatura de funcionamiento | -40C to +100C (Industrial, I suffix) | -40 °C to +85 °C (Industrial) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Estado RoHS | Lead-free (per Altera ordering code suffix) | Compliant (lead-free, 'N' suffix) |
| Speed Grade | 8 | 8 |
| Status Suffix | N (lead-free, Pb-free) | — |
| Logic Elements | — | 4,608 |
| Total RAM Bits | — | 119,808 |
| Number of I/O Pins | — | 158 |
| Number of Logic Units / LABs | — | [DATA_NEEDED: number of LABs] |
| Core Voltage | — | 1.2 V |
| Maximum Toggle Frequency | — | 402.5 MHz |
| Configuration Modes | — | Active Serial (AS), Passive Serial (PS), JTAG |
| DSP Performance | — | Up to approximately 25 GMACS |