EP2C8AF256I8N vs EP2C8F256I6N Comparación
Comparación detallada lado a lado de EP2C8AF256I8N por Intel y EP2C8F256I6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2C8AF256I8N | EP2C8F256I6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $21,40 | $22,85 |
| Family | Cyclone II | Cyclone II |
| Logic Elements (LE) | 8,256 | — |
| Embedded Memory Bits | 165,888 bits (162 Kbit RAM) | — |
| Embedded Multipliers (18x18) | 36 | — |
| Maximum User I/O Pins | 182 | 182 |
| PLLs | 4 | — |
| Global Clocks | 16 | — |
| Configuration Elements | Embedded SRAM, JTAG, AS, PS | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-selectable) | — |
| Process Technology | 90 nm CMOS, SRAM-based | 90 nm CMOS |
| Encapsulado | 256-ball FBGA (FineLine BGA) | 256-ball FineLine BGA (FBGA-256), 1.00 mm pitch |
| Temperatura de funcionamiento | -40C to +100C (Industrial, I suffix) | — |
| Tipo de montaje | Surface Mount (BGA) | — |
| Estado RoHS | Lead-free (per Altera ordering code suffix) | Lead-free / RoHS compliant (N suffix) |
| Speed Grade | 8 | 6 |
| Status Suffix | N (lead-free, Pb-free) | — |
| Logic Elements | — | 8,256 |
| Logic Array Blocks (LABs) | — | 540 |
| Embedded Memory (M4K blocks) | — | 165,888 bits |
| Embedded 18 x 18 Multipliers | — | 36 |
| Phase-Locked Loops (PLLs) | — | 4 |
| Core Supply Voltage | — | 1.2 V (1.15 V min, 1.25 V max) |
| Maximum Internal Clock Frequency | — | 402.58 MHz |
| Operating Temperature (Industrial) | — | -40 C to +100 C (Tj) |
| Configuration Modes | — | JTAG, Active Serial (AS), Passive Serial (PS) |