EP2C8F256I8N vs EP2C8F256I8K Comparación
Comparación detallada lado a lado de EP2C8F256I8N por Intel y EP2C8F256I8K por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2C8F256I8N | EP2C8F256I8K |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $21,95 | $18,95 |
| Series | Cyclone II | — |
| Logic Elements (LEs) | 8,256 | — |
| Embedded Memory Bits | 165,888 bits | — |
| Total RAM Bits | 165,888 | 165,888 |
| Logic Blocks / Logic Cells | 540 (Logic Cells) | — |
| User I/O Pins | 182 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| Embedded 18x18 Multipliers | Up to 36 | 36 |
| PLLs | 2 | 4 |
| Global Clock Networks | 16 | 16 |
| Core Supply Voltage | 1.2 V | — |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Process Technology | 90 nm CMOS (SRAM-based) | 90 nm CMOS, SRAM-based |
| Package Type | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch | — |
| Temperatura de funcionamiento | -40C to +85C (industrial) | — |
| Configuration Method | SRAM, loaded from external EPCS flash at power-up | — |
| Estado RoHS | Compliant (Pb-free, lead-free reflow compatible) | Compliant |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Family | — | Cyclone II |
| Logic Elements | — | 8,256 |
| Logic Array Blocks (LABs) | — | 182 |
| User I/O Pins (max) | — | 182 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Encapsulado | — | 256-ball FBGA (FineLine BGA) |
| Temperatura de unión de funcionamiento | — | -40 °C to +100 °C (industrial) |
| Configuration | — | SRAM, requires external serial flash (EPCS/EPCQ) |
| Nivel MSL | — | 3 |