EP2S130F1508C3N vs EP2S130F1508C3 Comparación
Comparación detallada lado a lado de EP2S130F1508C3N por Intel y EP2S130F1508C3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2S130F1508C3N | EP2S130F1508C3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $270,00 | $1.350,00 |
| Family | Stratix II | Stratix II |
| Device | EP2S130 | — |
| Logic Elements (LEs) | 132,540 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count for EP2S130] | [DATA_NEEDED: ALM count] |
| LABs/CLBs | 6,627 | — |
| Total RAM Bits | 6,747,840 | — |
| Embedded Memory | M4K + M-RAM blocks | — |
| Number of I/O | 1,126 | — |
| Number of Logic Elements/Cells | 132,540 | — |
| Voltage - Supply | [DATA_NEEDED: VCCINT/VCCIO/VCCA/VCCPD nominal values] | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Temperatura de funcionamiento | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Encapsulado | 1508-FCBGA | 1508-ball FC-BGA |
| Speed Grade | C3 | C3 (commercial) |
| Process Node | 90 nm | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Nivel MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL level] |
| Logic Elements | — | 132,540 |
| Embedded Memory (bits) | — | 6,747,840 |
| Maximum User I/O | — | 1,126 |
| Process Technology | — | 90 nm |
| Core Voltage (typical) | — | 1.2 V |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Transceivers | — | [DATA_NEEDED: transceiver count/grade] |
| PLLs (Fast + Enhanced) | — | 8 + 4 (per family) |
| Configuration Modes | — | Passive Serial, Fast Passive Parallel, JTAG |