EP2S130F1508C3N vs EP2S130F1508C5RB Comparación
Comparación detallada lado a lado de EP2S130F1508C3N por Intel y EP2S130F1508C5RB por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2S130F1508C3N | EP2S130F1508C5RB |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $270,00 | $2.050,00 |
| Family | Stratix II | Stratix II |
| Device | EP2S130 | — |
| Logic Elements (LEs) | 132,540 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count for EP2S130] | — |
| LABs/CLBs | 6,627 | — |
| Total RAM Bits | 6,747,840 | — |
| Embedded Memory | M4K + M-RAM blocks | 6,747 Kbits (TriMatrix: MRAM/M4K/M512) |
| Number of I/O | 1,126 | — |
| Number of Logic Elements/Cells | 132,540 | — |
| Voltage - Supply | [DATA_NEEDED: VCCINT/VCCIO/VCCA/VCCPD nominal values] | — |
| Tipo de montaje | Surface Mount | Surface Mount (FBGA) |
| Temperatura de funcionamiento | 0C to +85C (commercial) | 0C to +85C (commercial, junction) |
| Encapsulado | 1508-FCBGA | 1508-ball FBGA (F1508), 40x40 mm, 1.5 mm pitch |
| Speed Grade | C3 | 5 (C5, commercial) |
| Process Node | 90 nm | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | Yes |
| Nivel MSL | [DATA_NEEDED: MSL rating] | 3 (per JEDEC J-STD-020) |
| Logic Elements | — | 132,600 |
| Logic Array Blocks (LABs) | — | 6,727 |
| User I/Os | — | 1,126 |
| Embedded 18x18 Multipliers | — | 252 (504 9x9 equivalent) |
| Process Technology | — | 90 nm CMOS |
| Core Voltage | — | 1.2 V (typical) |
| Lifecycle | — | Not Recommended for New Designs (NRND) |