EP2S130F780I4N vs EP2S130F780C4 Comparación
Comparación detallada lado a lado de EP2S130F780I4N por Intel y EP2S130F780C4 por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2S130F780I4N | EP2S130F780C4 |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $210,00 | $6.500,00 |
| Family | Stratix II | Stratix II |
| Logic Elements | 132,540 | 132,540 |
| Equivalent LEs (max) | Approx. 132,540 (density class up to 180k) | — |
| LABs/CLBs | 6,627 | — |
| Embedded Memory (bits) | 6,748,160 | — |
| Total RAM Bits | 6,748,160 | — |
| Maximum User I/Os | 534 | — |
| Number of Multipliers (18x18) | [DATA_NEEDED: multiplier count] | — |
| Number of PLLs | 16 | — |
| Process Technology | 90 nm CMOS (1.2 V, all-layer copper) | 90 nm CMOS |
| Core Voltage VCCINT | 1.2 V | — |
| I/O Voltage VCCIO | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-rail) | — |
| Maximum Internal Frequency | 711.24 MHz | — |
| Encapsulado | 780-ball FC-FBGA (FineLine BGA), 29x29 mm, 1.0 mm pitch | 780-ball FC-FBGA (flip-chip) |
| Operating Temperature (Case) | -40C to +100C (Industrial, I4 suffix) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant (lead-free) | Lead-free (per datasheet) |
| Logic Array Blocks (LABs) | — | 6,627 |
| User I/O Pins | — | 534 |
| Internal Frequency (max) | — | 717 MHz |
| Core Voltage | — | 1.2 V |
| Package Code | — | F (FBGA-780) |
| Package Body Size | — | 40 x 40 mm |
| Ball Pitch | — | 1.0 mm |
| Speed Grade | — | C4 (commercial) |
| Terminal Form | — | Ball (BGA) |