EP2S130F780I4N vs EP2S90F780I4NAB Comparación
Comparación detallada lado a lado de EP2S130F780I4N por Intel y EP2S90F780I4NAB por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2S130F780I4N | EP2S90F780I4NAB |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $210,00 | $1.390,00 |
| Family | Stratix II | Stratix II |
| Logic Elements | 132,540 | 90,960 |
| Equivalent LEs (max) | Approx. 132,540 (density class up to 180k) | — |
| LABs/CLBs | 6,627 | — |
| Embedded Memory (bits) | 6,748,160 | — |
| Total RAM Bits | 6,748,160 | 4,520,448 (4.5 Mbit) |
| Maximum User I/Os | 534 | — |
| Number of Multipliers (18x18) | [DATA_NEEDED: multiplier count] | — |
| Number of PLLs | 16 | — |
| Process Technology | 90 nm CMOS (1.2 V, all-layer copper) | — |
| Core Voltage VCCINT | 1.2 V | — |
| I/O Voltage VCCIO | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-rail) | — |
| Maximum Internal Frequency | 711.24 MHz | — |
| Encapsulado | 780-ball FC-FBGA (FineLine BGA), 29x29 mm, 1.0 mm pitch | 780-BGA (29x29 mm) |
| Operating Temperature (Case) | -40C to +100C (Industrial, I4 suffix) | — |
| Tipo de montaje | Surface Mount | Surface Mount (flip-chip BGA) |
| Estado RoHS | Compliant (lead-free) | Compliant |
| Series | — | Stratix II |
| User I/O Count | — | 534 |
| Number of I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Core Voltage | — | 1.15 V to 1.25 V |
| Temperatura de funcionamiento | — | -40C to +100C (Industrial) |
| Speed Grade | — | I4 (industrial, -4) |
| Transceivers | — | 12 channels up to 3.125 Gbps |
| DSP Blocks | — | Dedicated 18x18 multipliers |
| Nivel MSL | — | 3 (168 hours) |
| Lead-Free | — | Yes |