EP2S30F484C5N vs EP2S30F484C3N Comparación
Comparación detallada lado a lado de EP2S30F484C5N por Intel y EP2S30F484C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2S30F484C5N | EP2S30F484C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $367,48 | $797,96 |
| Family | Stratix II | — |
| Logic Elements | 33880 | — |
| Adaptive Logic Modules (ALMs) | 13552 | — |
| Logic Array Blocks (LABs) | 1694 | — |
| Maximum User I/O Pins | 342 | — |
| Embedded RAM Bits | 1369728 | — |
| DSP Blocks | 24 | — |
| Embedded 18x18 Multipliers | 24 | — |
| PLLs | 12 | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Process Technology | 90 nm CMOS | — |
| Speed Grade | C5 | — |
| Maximum Internal Frequency | 609.76 MHz | 816.99 MHz |
| Encapsulado | 484-Ball FBGA (FBGA-484) | — |
| Package Dimensions | 23 x 23 mm, 1.0 mm pitch | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | 3 (168 hours) | — |
| Estado RoHS | Compliant | — |
| FPGA Family | — | Stratix II |
| Number of Logic Elements/Cells | — | 33880 cells |
| Number of LABs | — | 1694 LABs |
| Total RAM Bits | — | 1369728 bits |
| Number of User I/Os | — | 342 |
| Core Supply Voltage | — | 1.2 V |
| Technology Process | — | 90 nm CMOS |
| Encapsulado / Carcasa | — | 484-BBGA, FC-FBGA |
| Number of Ball Terminals | — | 484 |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| Embedded Memory Blocks | — | [DATA_NEEDED: exact M4K/M512/M-RAM block counts] |
| Embedded Multipliers | — | [DATA_NEEDED: number of 18x18 embedded multipliers] |