EP2S60F1020I4 vs EP2S130F1020I4 Comparación
Comparación detallada lado a lado de EP2S60F1020I4 por Altera y EP2S130F1020I4 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2S60F1020I4 | EP2S130F1020I4 |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.454,92 | $1.395,00 |
| Manufacturer | Intel / Altera | — |
| Series | Stratix II | — |
| Logic Elements (LEs) | 60,440 | — |
| Embedded Memory (bits) | 2,544,192 | 6,747,840 |
| Number of LABs/CLBs | 3022 | — |
| Number of CLBs | 24176 | — |
| Maximum User I/O | 718 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Operating Voltage (Core) | 1.2 V | — |
| Process Technology | 90 nm CMOS | — |
| Temperature Grade | Industrial (-40C to +100C TJ) | — |
| Package Type | 1020-ball FC-FBGA (Fine-pitch Chip-Scale BGA) | — |
| Package Dimensions | 33 mm x 33 mm | — |
| Ball Pitch | 1.0 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount (FC-FBGA) |
| Configuration Method | Passive Serial / Fast Passive Parallel / JTAG | — |
| Number of PLLs | 12 | — |
| Global Clock Networks | 16 | — |
| Embedded Multipliers (18x18) | 36 | — |
| Transceiver Count | 0 (no embedded transceivers) | — |
| Maximum Embedded Memory Bandwidth | [DATA_NEEDED: memory bandwidth spec] | — |
| Estado RoHS | Non-compliant (contains lead per legacy Altera package) | Compliant (per distributor listings) |
| Family | — | Stratix II |
| Logic Elements | — | 132,540 |
| Equivalent LEs | — | ~180,000 |
| Adaptive Logic Modules (ALMs) | — | 53,016 |
| Embedded Memory (M512 blocks) | — | 530 |
| Embedded Memory (M4K blocks) | — | 768 |
| Embedded Memory (M-RAM blocks) | — | 4 |
| Embedded 18x18 Multipliers | — | 504 |
| DSP Blocks | — | 48 |
| User I/O Pins | — | 742 |
| User I/O Banks | — | 12 |
| Encapsulado | — | 1020-ball FC-FBGA (33x33 mm) |
| Process Node | — | 90 nm CMOS, all-layer copper |
| Core Voltage (VCCINT) | — | 1.2 V |
| Speed Grade | — | I (industrial performance) |
| Device Revision | — | 4 |
| Temperatura de unión de funcionamiento | — | -40C to +100C (industrial) |
| Configuration Scheme | — | Fast Passive Parallel x8, Passive Serial, JTAG |