EP2S60F484C3N vs EP2S60F484C5N Comparación
Comparación detallada lado a lado de EP2S60F484C3N por Intel y EP2S60F484C5N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2S60F484C3N | EP2S60F484C5N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.245,75 | $720,50 |
| Family | Stratix II | Stratix II |
| Logic Elements | 60,440 | 60,440 |
| Adaptive LUTs (ALUTs) | 48,352 | — |
| Embedded Memory (TriMatrix) | 2,544 Kbits (M4K + M512 + M-RAM) | — |
| Embedded DSP Blocks | 12 (48 GMACs at 450 MHz) | — |
| Maximum User I/O Pins | 334 | — |
| Encapsulado | 484-BGA (F484), 1.0 mm pitch | 484-ball FBGA (FineLine BGA) |
| Process Technology | 90 nm CMOS, 1.2 V core | 90 nm CMOS |
| Speed Grade | -3 (fastest commercial) | C5 (slowest) |
| Operating Temperature (Commercial) | 0C to +85C (TJ) | — |
| Supply Voltage VCCINT | 1.2 V nominal | — |
| Configuration Modes | FPP, AS, PS, JTAG | — |
| Nivel MSL | 3 (per JEDEC J-STD-020) | — |
| Estado RoHS | Compliant | Compliant (lead-free) |
| Lead-Free | Yes | — |
| Adaptive Logic Modules (ALMs) | — | 24,176 |
| Embedded Memory Bits | — | 2,544,192 bits |
| Embedded RAM Blocks (TriMatrix) | — | Yes |
| DSP Blocks | — | 36 |
| 18x18 Multipliers | — | Up to 144 (max for family: 384) |
| Maximum User I/O | — | 334 |
| Transceiver Blocks | — | 12 (up to 6.375 Gbps) |
| PLLs | — | 12 (enhanced + fast) |
| Core Voltage | — | 1.2 V |
| I/O Standards | — | LVTTL, LVCMOS, LVDS, LVPECL, PCI, PCI-X |
| Temperature Grade | — | Commercial (0C to +85C junction) |
| Configuration Scheme | — | SRAM-based, volatile (requires EPC16/EPC64 or JTAG) |