EP2S60F484C5N vs EP2S60F484C3N Comparación
Comparación detallada lado a lado de EP2S60F484C5N por Intel y EP2S60F484C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2S60F484C5N | EP2S60F484C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $720,50 | $1.245,75 |
| Family | Stratix II | Stratix II |
| Logic Elements | 60,440 | 60,440 |
| Adaptive Logic Modules (ALMs) | 24,176 | — |
| Embedded Memory Bits | 2,544,192 bits | — |
| Embedded RAM Blocks (TriMatrix) | Yes | — |
| DSP Blocks | 36 | — |
| 18x18 Multipliers | Up to 144 (max for family: 384) | — |
| Maximum User I/O | 334 | — |
| Transceiver Blocks | 12 (up to 6.375 Gbps) | — |
| PLLs | 12 (enhanced + fast) | — |
| Core Voltage | 1.2 V | — |
| I/O Standards | LVTTL, LVCMOS, LVDS, LVPECL, PCI, PCI-X | — |
| Speed Grade | C5 (slowest) | -3 (fastest commercial) |
| Temperature Grade | Commercial (0C to +85C junction) | — |
| Encapsulado | 484-ball FBGA (FineLine BGA) | 484-BGA (F484), 1.0 mm pitch |
| Process Technology | 90 nm CMOS | 90 nm CMOS, 1.2 V core |
| Estado RoHS | Compliant (lead-free) | Compliant |
| Configuration Scheme | SRAM-based, volatile (requires EPC16/EPC64 or JTAG) | — |
| Adaptive LUTs (ALUTs) | — | 48,352 |
| Embedded Memory (TriMatrix) | — | 2,544 Kbits (M4K + M512 + M-RAM) |
| Embedded DSP Blocks | — | 12 (48 GMACs at 450 MHz) |
| Maximum User I/O Pins | — | 334 |
| Operating Temperature (Commercial) | — | 0C to +85C (TJ) |
| Supply Voltage VCCINT | — | 1.2 V nominal |
| Configuration Modes | — | FPP, AS, PS, JTAG |
| Nivel MSL | — | 3 (per JEDEC J-STD-020) |
| Lead-Free | — | Yes |