EP2S60F484C5N vs EP2S60F484I4 Comparación
Comparación detallada lado a lado de EP2S60F484C5N por Intel y EP2S60F484I4 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2S60F484C5N | EP2S60F484I4 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $720,50 | $138,40 |
| Family | Stratix II | Stratix II FPGA |
| Logic Elements | 60,440 | — |
| Adaptive Logic Modules (ALMs) | 24,176 | — |
| Embedded Memory Bits | 2,544,192 bits | 2,544,192 bits (~317 KB) |
| Embedded RAM Blocks (TriMatrix) | Yes | — |
| DSP Blocks | 36 | [DATA_NEEDED: DSP block count] |
| 18x18 Multipliers | Up to 144 (max for family: 384) | — |
| Maximum User I/O | 334 | — |
| Transceiver Blocks | 12 (up to 6.375 Gbps) | — |
| PLLs | 12 (enhanced + fast) | 4 |
| Core Voltage | 1.2 V | 1.2 V |
| I/O Standards | LVTTL, LVCMOS, LVDS, LVPECL, PCI, PCI-X | — |
| Speed Grade | C5 (slowest) | I4 (industrial, fastest speed bin for Stratix II F484) |
| Temperature Grade | Commercial (0C to +85C junction) | — |
| Encapsulado | 484-ball FBGA (FineLine BGA) | 484-ball FBGA (F484) |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Estado RoHS | Compliant (lead-free) | — |
| Configuration Scheme | SRAM-based, volatile (requires EPC16/EPC64 or JTAG) | — |
| Series | — | Stratix II |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements (LE) | — | 60,440 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Total RAM Blocks | — | [DATA_NEEDED: total RAM blocks] |
| User I/O Pins | — | 334 |
| User I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| High-Speed Transceivers | — | 12 channels |
| Transceiver Data Rate | — | [DATA_NEEDED: max Gbps] |
| Rango de temperatura de funcionamiento | — | -40 °C to +100 °C (Industrial, I4) |
| Ball Pitch | — | [DATA_NEEDED: ball pitch in mm] |
| Tipo de montaje | — | Surface Mount |
| Lead-Free / RoHS | — | Contains Lead; RoHS Non-Compliant (per distributor data) |
| Configuration Method | — | SRAM-based, loaded via Quartus II bitstream |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |