EP2S60F672C3N vs EP2S60F672C3NGA Comparación
Comparación detallada lado a lado de EP2S60F672C3N por Intel y EP2S60F672C3NGA por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2S60F672C3N | EP2S60F672C3NGA |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.175,00 | $1.150,00 |
| Family | Stratix II | Stratix II |
| Logic Elements (LE) | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | 3,022 |
| Adaptive Logic Modules (ALMs) | 24,176 | — |
| Total Embedded Memory | 2,544,192 bits (2.5 Mbits) | — |
| User I/O Pins | 492 | 492 |
| User I/O Banks | 8 | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Supply Voltage (VCCINT) | 1.2 V | — |
| I/O Supply Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Pre-Driver Supply (VCCPD) | 3.3 V | — |
| Maximum Internal Clock Frequency | 816.99 MHz | — |
| PLLs | 4 | Up to 12 |
| Global Clock Networks | 16 | — |
| Encapsulado | 672-pin FC-FBGA | 672-FBGA (FineLine BGA, 27x27 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | 0C to +85C (commercial grade) | — |
| Speed Grade | C3 (slower speed grade) | — |
| Estado RoHS | unknown | Compliant |
| Lead-Free | unknown | — |
| Logic Elements (LEs) | — | 60,440 |
| Total RAM Bits | — | 2,544,192 |
| Core Voltage | — | 1.2 V (typical) |
| DSP Blocks | — | 18 blocks (multi 9x9 multipliers) |
| Configuration Mode | — | JTAG / Passive Serial / Fast Passive Parallel |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Lifecycle | — | Not Recommended for New Designs (NRND) |