EP2SGX30CF780C6 vs EP2SGX30CF780C3 Comparación
Comparación detallada lado a lado de EP2SGX30CF780C6 por Intel y EP2SGX30CF780C3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2SGX30CF780C6 | EP2SGX30CF780C3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $165,00 | $175,50 |
| Family | Stratix II GX | Stratix II GX |
| Series | EP2SGX | — |
| Logic Elements (LE) | 33,880 | — |
| Adaptive Logic Modules (ALM) | 13,540 | — |
| Embedded Memory Bits | 1,369,728 bits (171 KBytes) | — |
| Embedded Multiplier 18x18 | 64 (estimated, datasheet required for exact count) | — |
| User I/O Pins | 361 | — |
| High-Speed Transceivers | Up to 8 channels (FPGA-dependent configuration) | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Encapsulado | 780-ball FineLine BGA (F780) | 780-ball FineLine BGA |
| Speed Grade | C6 (commercial, mid-speed) | -3 |
| Temperatura de funcionamiento | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Core Voltage | 1.2 V (typical) | — |
| Configuration Mode | Enhanced passive/active (EPC) supported | — |
| Process Technology | 90 nm | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | Yes |
| Logic Elements | — | 33,880 |
| Logic Array Blocks (LABs) | — | 1,694 |
| Embedded RAM Bits | — | 1,369,728 |
| User I/Os | — | 361 |
| Process Node | — | 90 nm |
| Transceivers | — | Embedded (GX family, up to 3.125 Gbps per channel) |
| Memory Interfaces | — | DDR / DDR2 / QDRII PHY |
| Tipo de montaje | — | Surface Mount (BGA) |
| Sin halógenos | — | [DATA_NEEDED: halogen-free status] |