EP2SGX60CF780C3 vs EP2SGX60DF780C3 Comparación
Comparación detallada lado a lado de EP2SGX60CF780C3 por Intel y EP2SGX60DF780C3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2SGX60CF780C3 | EP2SGX60DF780C3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $870,00 | $218,00 |
| Family | Stratix II GX | Stratix II GX |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | 3,022 |
| On-chip RAM Bits | 2,544,192 (~317 KB) | — |
| User I/Os | 364 | — |
| Transceivers | Up to 12 multi-gigabit transceivers (per family datasheet) | — |
| Transceiver Data Rate (max) | 6.375 Gbps (per Stratix II GX family datasheet) | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm CMOS, SRAM-based | 90 nm |
| Speed Grade | C3 (commercial) | C3 (fastest commercial) |
| Encapsulado | 780-ball FineLine BGA (FBGA-780), 29 mm x 29 mm, 1.0 mm pitch | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch |
| Temperatura de funcionamiento | Commercial (0C to +85C junction) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) |
| Series | — | Stratix II |
| Logic Elements / Cells | — | 60,440 |
| Total RAM Bits | — | [DATA_NEEDED: total embedded memory bits] |
| Number of I/O | — | 364 |
| Number of Transceivers | — | Up to 20 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Internal Frequency (max) | — | ~717 MHz |
| Operating Temperature (TJ) | — | 0 °C to +85 °C (commercial, C speed grade) |