EP2SGX60CF780C7 vs EP2SGX60DF780C7 Comparación
Comparación detallada lado a lado de EP2SGX60CF780C7 por Altera y EP2SGX60DF780C7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP2SGX60DF780C7 - Stratix II GX 60K LE FPGA, 364 I/O, 780-BGA | Intel
EP2SGX60DF780C7 ObsoleteComparación de especificaciones
| Parámetro | EP2SGX60CF780C7 | EP2SGX60DF780C7 |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $215,00 | $348,00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 60,440 | 60,440 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 2,544,192 bits | — |
| DSP Blocks | 24 (18x18 multipliers) | — |
| Maximum User I/O | 364 | — |
| Transceiver Channels | 12 | — |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps | — |
| Core Voltage | 1.2 V | — |
| Process Node | 90 nm | — |
| Speed Grade | C7 | C7 (slowest commercial) |
| Encapsulado | 780-ball FCBGA | 780-ball FBGA (FineLine BGA) |
| Ball Pitch | 1.0 mm | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | — |
| Configuration Scheme | Enhanced Configuration (EPC) | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status] |
| Logic Array Blocks (LABs) | — | 3,022 |
| Total RAM Bits | — | 2,544,192 |
| User I/O Pins | — | 364 |
| Process Technology | — | 90 nm |
| Core Supply Voltage | — | 1.15 V to 1.25 V |
| Operating Junction Temperature (Commercial) | — | 0 C to 85 C |
| Tipo de montaje | — | Surface Mount |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Design Software | — | Quartus II (legacy, EOL toolchain) |