EP2SGX60CF780I4N vs EP2SGX60CF780C4 Comparación
Comparación detallada lado a lado de EP2SGX60CF780I4N por Altera y EP2SGX60CF780C4 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2SGX60CF780I4N | EP2SGX60CF780C4 |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $171,00 | $171,00 |
| Family | Stratix II GX | — |
| Device Type | FPGA | — |
| Logic Elements | 60,440 | 60,440 |
| Logic Blocks / CLBs | 60,440 | — |
| Embedded Memory | 2,542 Kbit (TriMatrix) | — |
| Number of Transceivers | Up to 20 | [DATA_NEEDED: number of transceivers] |
| Transceiver Data Rate | 622 Mbps to 6.375 Gbps | — |
| Core Supply Voltage | 1.2 V (range 1.15 V to 1.25 V) | 1.2 V |
| Maximum Internal Frequency | 717 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Number of PLLs | 12 (4 fast + 8 enhanced) | — |
| Global Clock Networks | 16 | — |
| Package Type | FC-FBGA-780 (BGA-780) | Flip-Chip Fine-Pitch BGA |
| Package Size | 23 x 23 mm | — |
| Ball Pitch | 1.0 mm | — |
| Operating Temperature Grade | Industrial | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS compliance] |
| Device Family | — | Stratix II GX |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| LABs/CLBs | — | 3,022 |
| User I/O Count | — | 364 |
| Total Memory Bits | — | 2,544,192 |
| Internal Operating Frequency | — | up to 732.1 MHz |
| Propagation Delay | — | [DATA_NEEDED: propagation delay ns] |
| Encapsulado | — | 780-ball FC-FBGA (23 x 23 mm, 1 mm pitch) |
| Speed Grade | — | C4 (commercial) |
| Temperatura de funcionamiento | — | Commercial (0C to +85C) [DATA_NEEDED: exact TJ range] |