EP2SGX60EF1152C3 vs EP2SGX60F1508 Comparación
Comparación detallada lado a lado de EP2SGX60EF1152C3 por Intel y EP2SGX60F1508 por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP2SGX60EF1152C3 - Stratix II GX FPGA 60K LE 1152-FBGA | Intel
EP2SGX60EF1152C3 ⚠ Última compra
Comparación de especificaciones
| Parámetro | EP2SGX60EF1152C3 | EP2SGX60F1508 |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.210,00 | $1.920,00 |
| Device Family | Stratix II GX | — |
| Logic Elements | 60,440 | 60,440 |
| LABs / CLBs | 3,022 | — |
| User I/Os | 534 | — |
| Total Memory Bits | 2,544,192 | — |
| Number of Transceivers | 36 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Internal Frequency | 717 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm | — |
| Multipliers (18x18) | 252 | — |
| Encapsulado | 1152-ball FC-FBGA (35 x 35 mm) | 1508-pin FBGA (F1508), 1.0 mm pitch |
| Tipo de montaje | Surface Mount | — |
| Temperatura de funcionamiento | 0C to +85C (Commercial, C3 suffix) | — |
| Configuration Memory Interface | EPCS serial configuration devices | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes | — |
| Family | — | Stratix II GX |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (M512/M4K/M-RAM) | — | 2,542,387 bits (TriMatrix) |
| DSP Blocks (18x18) | — | 144 (estimated from 60K LE tier) |
| DSP Performance | — | Up to 384 GMACs |
| Transceivers | — | 12 channels |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Maximum User I/O Pins | — | [DATA_NEEDED: user I/O count] |
| PLLs (general purpose) | — | 4 |
| Transmit PLLs | — | 8 |
| Global Clock Networks | — | 8 |
| Process Node | — | 90 nm CMOS |
| Hard IP Blocks | — | PCI Express x1/x4/x8, Serial RapidIO, GXB PCS |
| Operating Temperature (industrial) | — | -40C to +100C |