EP2SGX60EF1152C3N vs EP2SGX60EF1152C4K Comparación
Comparación detallada lado a lado de EP2SGX60EF1152C3N por Intel y EP2SGX60EF1152C4K por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2SGX60EF1152C3N | EP2SGX60EF1152C4K |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.195,00 | $1.250,00 |
| Family | Stratix II GX | — |
| Series | Stratix II | Stratix II GX |
| Logic Elements | 60,440 | 60,440 |
| Adaptive Logic Modules (ALMs) | 30,220 | 24,176 |
| Logic Array Blocks (LABs) | 3022 | 3022 |
| Embedded Memory (bits) | 2,544,192 | 2,544,192 |
| Maximum User I/Os | 534 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Voltage (Vcc) | 1.2 V | — |
| Maximum Internal Frequency | 717 MHz | — |
| Propagation Delay | 0.40 ns | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: embedded multiplier count] | — |
| PLLs | 4 | — |
| Transceiver Data Rate | 3.125 Gbps per channel | — |
| Encapsulado | 1152-BBGA (FC-FBGA) 35 x 35 mm, 1.0 mm pitch | 1152-BBGA / FC-FBGA, Flip-Chip |
| Speed Grade | C3 (commercial, -3 bin) | C4 |
| Temperatura de funcionamiento | 0C to +85C (commercial) | 0C to 85C (Commercial) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Manufacturer | — | Intel / Altera |
| Device Family | — | Stratix II GX |
| Embedded Memory (Kbits) | — | 3024 |
| Embedded 18x18 Multipliers | — | Up to 252 |
| User I/Os | — | 534 |
| Transceivers | — | Up to 12 (6.375 Gbps) |
| Maximum Fabric Frequency | — | 732.1 MHz |
| Core Voltage (VCC) | — | 1.2 V |
| Estado RoHS | — | [DATA_NEEDED: RoHS status] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Configuration Mode | — | Enhanced Configuration (EPC) - K suffix |