EP2SGX60EF1152I5N vs EP2SGX90EF1152I5N Comparación
Comparación detallada lado a lado de EP2SGX60EF1152I5N por Intel y EP2SGX90EF1152I5N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP2SGX90EF1152I5N - 90k LEs Stratix II GX FPGA 1.2V FC-FBGA-1152 | Intel
EP2SGX90EF1152I5N ObsoleteComparación de especificaciones
| Parámetro | EP2SGX60EF1152I5N | EP2SGX90EF1152I5N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Unknown | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $1.320,00 |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Family | Stratix II GX | Stratix II GX |
| Logic Cells | 60,440 | — |
| Logic Blocks | 60,440 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | — |
| Internal Frequency | 717 MHz | — |
| Reported Internal Frequency | 609.76 MHz | — |
| Frecuencia de reloj máxima | 622.08 MHz | 609.76 MHz |
| Rango de temperatura de funcionamiento | -40 °C to 85 °C | — |
| Encapsulado | 1152-ball BGA | — |
| Package Type | FC-FBGA | FC-FBGA (flip-chip fine-pitch BGA) |
| Package Dimensions | 23 x 23 mm | — |
| Terminal Pitch | 1 mm | — |
| Number of Terminals | 1152 | — |
| Terminal Form | Ball | BALL |
| Temperature Grade | Industrial | — |
| Propagation Delay | [DATA_NEEDED: propagation delay] | — |
| Configuration Memory | [DATA_NEEDED: configuration memory type and size] | — |
| I/O Count | [DATA_NEEDED: user I/O count] | — |
| Transceiver Count | [DATA_NEEDED: transceiver count] | — |
| Estado RoHS | unknown | [DATA_NEEDED: RoHS status] |
| REACH Status | unknown | — |
| Series | — | EP2SGX90 |
| Logic Elements (LEs) | — | 90,960 |
| Equivalent CLBs | — | 90,960 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Combinatorial Delay | — | 4.006 ns |
| Number of Pins/Balls | — | 1152 |
| Package Code | — | BGA |
| Package Shape | — | SQUARE |
| Operating Temperature Grade | — | INDUSTRIAL (I) |
| Embedded Transceivers | — | Yes (GX series, multi-gigabit PMA) |
| On-chip Block Memory | — | [DATA_NEEDED: total M512/M4K/M-RAM bits] |
| DSP Blocks | — | [DATA_NEEDED: number of DSP blocks] |
| User I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Tipo de montaje | — | Surface Mount |