EP2SGX90EF1152I3 vs EP2SGX90EF1152C5N Comparación
Comparación detallada lado a lado de EP2SGX90EF1152I3 por Intel y EP2SGX90EF1152C5N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2SGX90EF1152I3 | EP2SGX90EF1152C5N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.480,00 | $1.380,00 |
| Series | Stratix II GX | Stratix II GX |
| Logic Elements | 90,960 | 90,960 |
| Adaptive Logic Modules (ALMs) | 558 | — |
| Equivalent Logic Cells (CLBs) | 90,960 | — |
| Total RAM Bits | 4,520,448 | 4,520,448 |
| Maximum Operating Frequency | 622.08 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Supply Voltage (VCCINT) | 1.2 V nominal (1.15 V to 1.25 V) | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Package Type | 1152-ball FC-FBGA (flip-chip) | — |
| Terminal Form | Ball | — |
| Terminal Pitch | [DATA_NEEDED: ball pitch] | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Configuration Architecture | Enhanced Configuration (EPC) devices supported | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Family | — | FPGA - Field Programmable Gate Array |
| Logic Array Blocks (LABs) | — | 4,548 |
| User I/Os | — | 558 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Core Voltage | — | 1.2 V |
| Encapsulado | — | 1152-ball FC-FBGA |
| Speed Grade | — | 5 |
| Temperatura de funcionamiento | — | 0C to +85C (Commercial) |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |
| Transceivers | — | Up to 12 multi-gigabit transceivers |
| Transceiver Data Rate | — | Up to 6.375 Gbps |