EP2SGX90FF1508C4N vs EP2SGX90FF1508C3N Comparación
Comparación detallada lado a lado de EP2SGX90FF1508C4N por Intel y EP2SGX90FF1508C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP2SGX90FF1508C3N - 90K LE Stratix II GX FPGA, 1508-FCBGA | Intel / Altera
EP2SGX90FF1508C3N ⚠ Última compraComparación de especificaciones
| Parámetro | EP2SGX90FF1508C4N | EP2SGX90FF1508C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.500,00 | $1.295,00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LE) | 90960 | — |
| LABs/CLBs | 4548 | 4548 |
| Total RAM Bits | 4520448 | 4,520,448 bits |
| Number of I/O | 650 | — |
| Voltage - Supply | [DATA_NEEDED: VCCINT/VCCIO supply voltages] | — |
| Temperatura de funcionamiento | 0C to +85C (commercial grade per 'C' suffix) | 0C to +85C (Commercial) |
| Encapsulado / Carcasa | 1508-BBGA, FCBGA (PBGA1508, 40 x 40 mm, 1 mm pitch) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Process Node | 90 nm | — |
| Transceivers | Embedded multi-gigabit transceivers (Stratix II GX feature) | — |
| DSP Blocks | Yes (dedicated variable-precision DSP blocks) | — |
| Nivel MSL | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: MSL rating] |
| Estado RoHS | Lead-free per 'N' suffix; RoHS status to be confirmed | Compliant |
| Lead Free | Yes (lead-free finish per datasheet summary) | Yes |
| Logic Elements (LEs) | — | 90,960 |
| Adaptive Logic Modules (ALMs) | — | 45,480 (approx.) |
| Embedded Multipliers (18x18) | — | 384 |
| User I/Os | — | 650 |
| Number of I/O Banks | — | 12 |
| Transceiver Channels | — | 12 |
| Maximum Transceiver Data Rate | — | 6.375 Gbps |
| PLLs (Total) | — | 8 (4 fast + 4 enhanced) |
| Core Voltage | — | 1.2 V |
| Process Technology | — | 90 nm CMOS |
| Encapsulado | — | 1508-ball FC-FBGA (FCBGA), 40 x 40 mm, 1.0 mm pitch |
| Speed Grade | — | C3 |