EP3C16F484I7 vs EP3C120F484I7N Comparación
Comparación detallada lado a lado de EP3C16F484I7 por Intel y EP3C120F484I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C16F484I7 | EP3C120F484I7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $58,10 | $84,70 |
| Family | Cyclone III | Cyclone III |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements | 15,408 | 119,088 |
| Logic Array Blocks (LABs) | 963 | 7,443 |
| Total Embedded Memory | 516,096 bits (63 KB) | — |
| Embedded Memory Blocks | M9K x 56 | — |
| Embedded 18x18 Multipliers | 56 | — |
| User I/Os | 346 | — |
| General-Purpose PLLs | 4 | — |
| Encapsulado | 484-ball FineLine BGA (F484) | 484-FBGA (FBGA-484) 23 x 23 mm, 1.0 mm pitch |
| Temperatura de funcionamiento | -40C to +100C (industrial) | -40 °C to +100 °C (industrial, -I7N) |
| Speed Grade | 7 (fastest commercial/industrial) | 7 (commercial/industrial) |
| Process Node | 60 nm TSMC low-power | — |
| Configuration Method | Passive Serial, Fast Passive Parallel, Active Serial, JTAG | — |
| Estado RoHS | Compliant | Compliant (lead-free) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Device Type | — | FPGA |
| Embedded Memory (M9K blocks) | — | 432 |
| Embedded Memory Bits | — | 3,981,312 (approx. 4 Mbits) |
| Embedded Multipliers (18x18) | — | 288 |
| Maximum User I/O Pins | — | 283 |
| Process Technology | — | 65 nm |
| Core Voltage (VCCINT) | — | 1.15 V to 1.25 V |
| I/O Bank Count | — | 8 |
| Internal Operating Frequency (max) | — | 472 MHz |
| Sin halógenos | — | Compliant |