EP3C16F484I7N vs EP3C55F484I8N Comparación
Comparación detallada lado a lado de EP3C16F484I7N por Altera y EP3C55F484I8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C16F484I7N | EP3C55F484I8N |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $36,40 | $61,50 |
| Series | Cyclone III | Cyclone III |
| Family | Cyclone III | — |
| Logic Elements (LE) | 15408 | 55,856 |
| Total Memory Bits | 516096 | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | — |
| Embedded Multipliers (18x18) | 56 | 312 |
| User I/O Pins | 346 | 327 |
| PLLs | [DATA_NEEDED: PLL count from datasheet] | 4 |
| Global Clock Networks | 20 | — |
| Process Technology | 65 nm | 65 nm low-power CMOS |
| Core Voltage | 1.2 V | — |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | — |
| Speed/Grade | I7 (industrial, 7 speed grade) | — |
| Encapsulado | 484-FBGA (FineLine BGA, 1.0 mm pitch) | 484-ball FBGA (FineLine BGA), 23 mm x 23 mm |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes (N suffix) | Yes |
| Configuration Mode | SRAM / JTAG / Passive Serial | — |
| Logic Array Blocks (LAB) | — | 3,491 |
| Embedded Memory Bits | — | 2,396,160 bits (approximately 234 Kbytes) |
| I/O Banks | — | 8 |
| Core Voltage (VCCINT) | — | 1.2 V nominal (1.15 V to 1.25 V) |
| Auxiliary Voltage (VCCAUX) | — | 2.5 V nominal |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V per bank |
| Temperatura de unión de funcionamiento | — | -40 C to +100 C (industrial, suffix I8) |
| Speed Grade | — | 8 (slowest Cyclone III timing bin) |
| Configuration Modes | — | AS, PS, FPP, JTAG |
| Nivel MSL | — | 3 |