EP3C16U256C8N vs EP3C5U256C8N Comparación
Comparación detallada lado a lado de EP3C16U256C8N por Intel y EP3C5U256C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C16U256C8N | EP3C5U256C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $48,40 | $19,85 |
| Family | Cyclone III | — |
| Logic Elements | 15,408 | — |
| Total Memory Bits | 516,096 bits | — |
| Embedded Multipliers (18 x 18) | 56 | — |
| PLLs | 4 | — |
| Maximum User I/O | 168 | — |
| Encapsulado | 256-ball Ultra FineLine BGA (Ux256, 17 mm x 17 mm) | 256-UBGA (Ultra FineLine BGA) |
| Core Voltage (VCCINT) | 1.2 V | — |
| Process Technology | 65 nm low-power | 60 nm CMOS, SRAM-based configuration |
| Speed Grade | 8 (C8, commercial) | 8 (commercial) |
| Temperatura de unión de funcionamiento | -40 °C to +85 °C | — |
| Configuration Modes | JTAG, AS, PS, FPP | — |
| Tipo de montaje | Surface Mount (BGA, requires microvia PCB) | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Estado RoHS | Compliant (Pb-free) | — |
| Series | — | Cyclone III |
| Family Name | — | Cyclone® III |
| Logic Elements (LE) | — | 5,136 |
| Number of CLBs | — | 5,136 |
| Number of Logic Cells | — | 5,136 |
| Total RAM Bits | — | 423,936 |
| Number of I/O | — | 182 |
| Tensión de alimentación | — | 1.2 V core, 1.2-3.3 V I/O |
| Number of Embedded Multipliers (18x18) | — | 46 |
| Number of PLLs | — | 4 |
| Maximum Operating Frequency | — | [DATA_NEEDED: maximum operating frequency] |
| Package Dimensions | — | 14 x 14 mm, 0.8 mm ball pitch |
| Lead Free / RoHS | — | Lead Free, RoHS Compliant |
| Temperatura de funcionamiento | — | 0C to +85C (commercial, "C" suffix) |