EP3C25F324C7N vs EP3C25F324I7 Comparación
Comparación detallada lado a lado de EP3C25F324C7N por Intel y EP3C25F324I7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C25F324C7N | EP3C25F324I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $64,80 |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Device Family | Cyclone III | — |
| Logic Cells | 24,624 cells | — |
| Embedded Memory | 608,256 bits | 608,256 bits (594 Kbits M9K blocks) |
| Available I/O Pins | 215 I/O | — |
| Maximum Listed Frequency | 437.5 MHz | — |
| Process Technology | 65 nm | TSMC 65 nm low-power CMOS |
| Core Voltage | 1.2 V | — |
| Encapsulado | 324-ball FBGA | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Terminal Count | 324 terminals | — |
| Terminal Form | Ball | — |
| Package Code | BGA | — |
| Package Shape | Rectangular | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperature Grading | Other | — |
| Programmability | Field programmable | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Series | — | Cyclone III |
| Logic Elements (LEs) | — | 24,624 |
| Logic Array Blocks (LABs) | — | 1,539 |
| Embedded 18x18 Multipliers | — | 66 |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Maximum User I/O | — | 215 |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V (per bank) |
| Temperatura de unión de funcionamiento | — | -40 °C to +100 °C (industrial) |
| Configuration Modes | — | Passive Serial (PS), Active Serial (AS), JTAG |