EP3C55F484I7 vs EP3C55F484C7N Comparación
Comparación detallada lado a lado de EP3C55F484I7 por Intel y EP3C55F484C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C55F484I7 | EP3C55F484C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $175,54 | $52,75 |
| Series | Cyclone III | — |
| Manufacturer | Intel (formerly Altera) | — |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements / Cells | 55,856 | — |
| Adaptive Logic Modules (ALMs) | 3,491 | — |
| Number of Logic Array Blocks (LABs) | 3,491 | — |
| Number of I/O | 327 | — |
| Embedded Memory (bits) | 2,396,160 (2,340 Kbits) | 2,396,160 |
| Number of Logic Blocks / CLBs | 55856 | — |
| Embedded Multipliers (18 × 18) | 156 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | 20 |
| Internal Maximum Frequency | 472.5 MHz | — |
| Core Voltage | 1.2 V | — |
| Temperatura de funcionamiento | -40 °C to +100 °C (Industrial grade, I-suffix) | 0C to 85C (Commercial) |
| Encapsulado | 484-FBGA (F484), 23 × 23 mm, 1.0 mm pitch | 484-FBGA (FineLine BGA) |
| Tipo de montaje | Surface Mount (BGA) | — |
| Estado RoHS | Lead-Free, RoHS Compliant | Compliant |
| Nivel MSL | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Process Technology | CMOS (Cyclone III low-power 65 nm family) | 60 nm TSMC low-power |
| Family | — | Cyclone III |
| Logic Elements | — | 55,856 |
| Maximum User I/O | — | 327 |
| Number of LABs/CLBs | — | 3,491 |
| Embedded Multipliers (18x18) | — | 156 |
| Speed Grade | — | 7 |
| Configuration Modes | — | JTAG, AS, AP, PS |
| Encryption | — | AES-256 |
| Tensión de alimentación | — | 1.2 V core (VCCINT) |