EP3C55U484C7 vs EP3C40U484C7N Comparación
Comparación detallada lado a lado de EP3C55U484C7 por Intel y EP3C40U484C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C55U484C7 | EP3C40U484C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $23,10 | $119,40 |
| Series | Cyclone III | Cyclone® III |
| Logic Elements (LEs) | 55,856 | — |
| Logic Array Blocks (LABs) | 3,488 | — |
| Embedded Memory (bits) | 2,396,160 | — |
| Embedded Multipliers (18x18) | 156 | 126 |
| Maximum User I/O Pins | 327 | — |
| Number of PLLs | 4 | 4 |
| Maximum Operating Frequency | 437 MHz | — |
| Process Technology | 65 nm CMOS | 65 nm TSMC low-k |
| Core Voltage | 1.2 V | — |
| I/O Bank Voltages | 1.2 V / 2.5 V / 3.0 V / 3.3 V | — |
| Encapsulado | 484-ball UBGA (Ultra-FineLine BGA) | — |
| Package Dimensions | 19 x 19 mm | — |
| Ball Pitch | 0.80 mm | — |
| Speed Grade | C7 (Commercial) | — |
| Temperatura de funcionamiento | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Family | — | Cyclone III (Low-Power FPGA) |
| Logic Elements | — | 39,600 |
| Total RAM Bits | — | 1,161,216 |
| Number of I/O | — | 331 (maximum user I/O) |
| Number of LABs/CLBs | — | 2,481 |
| Number of Logic Elements/Cells | — | 39,600 |
| Total Memory | — | 1161216 bit |
| Supply Voltage - Core | — | 1.2 V |
| Encapsulado / Carcasa | — | 484-FBGA (UBGA, 19x19 mm) |
| Configuration Method | — | SRAM (JTAG / Active Serial) |
| Lead-Free | — | Yes |