EP3C55U484C7 vs EP3C55U484C6N Comparación
Comparación detallada lado a lado de EP3C55U484C7 por Intel y EP3C55U484C6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C55U484C7 | EP3C55U484C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $23,10 | $274,06 |
| Series | Cyclone III | — |
| Logic Elements (LEs) | 55,856 | — |
| Logic Array Blocks (LABs) | 3,488 | — |
| Embedded Memory (bits) | 2,396,160 | — |
| Embedded Multipliers (18x18) | 156 | — |
| Maximum User I/O Pins | 327 | — |
| Number of PLLs | 4 | — |
| Maximum Operating Frequency | 437 MHz | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Voltage | 1.2 V | — |
| I/O Bank Voltages | 1.2 V / 2.5 V / 3.0 V / 3.3 V | — |
| Encapsulado | 484-ball UBGA (Ultra-FineLine BGA) | 484-FBGA |
| Package Dimensions | 19 x 19 mm | — |
| Ball Pitch | 0.80 mm | — |
| Speed Grade | C7 (Commercial) | — |
| Temperatura de funcionamiento | 0C to +85C (Commercial) | [DATA_NEEDED: operating temperature range] |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Family | — | Cyclone III |
| Logic Elements | — | 55856 LE |
| Number of Logic Cells | — | 55856 cells |
| Embedded Memory | — | 2396160 bit |
| I/O Count | — | 327 I/O |
| Core Technology Voltage | — | 1.2 V |
| JTAG LVTTL/LVCMOS Operation | — | 3.3 V, 3.0 V, 2.5 V |
| Package Code | — | FBGA |
| Terminal Count | — | 484 |
| Terminal Form | — | Ball |
| Clock Rate | — | 437.5 MHz |
| REACH Status | — | unknown |
| Automotive Qualification | — | unknown |
| Lead-Free Status | — | unknown |
| Configuration Interface | — | [DATA_NEEDED: configuration interface] |
| Maximum I/O Voltage | — | [DATA_NEEDED: maximum I/O voltage] |
| Resistencia térmica | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |