EP3C5U256C8 vs EP3C5U256C7 Comparación
Comparación detallada lado a lado de EP3C5U256C8 por Intel y EP3C5U256C7 por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C5U256C8 | EP3C5U256C7 |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $17,20 | $16,10 |
| Series | Cyclone® III | Cyclone III |
| Logic Elements | 5,136 | 5,136 |
| Total Memory Bits | 423,936 | — |
| Number of Logic Array Blocks (LABs) | 182 | — |
| Number of I/O Pins | 182 (maximum user I/O) | — |
| Embedded 18x18 Multipliers | 23 | — |
| PLLs | 2 | 4 |
| Encapsulado | 256-LFBGA (UBGA) | 256-UBGA (Ultra FineLine BGA) |
| Package Code | LFBGA-256, 17x17 mm | — |
| Speed Grade | 8 (commercial) | -7 (commercial) |
| Temperatura de funcionamiento | 0C to +85C (commercial grade) | — |
| Core Voltage | 1.0 V to 1.2 V (1.2 V nominal) | — |
| I/O Voltage Support | LVDS, LVCMOS, SSTL, HSTL | — |
| Configuration Modes | JTAG, Active Serial, Active Parallel, Passive Serial | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Process Technology | 60 nm low-power CMOS | 65 nm low-k CMOS |
| Total RAM Bits | — | 423,936 |
| Logic Array Blocks (LABs) | — | 321 |
| Embedded Multipliers (18x18) | — | 46 |
| Embedded Memory Blocks (M9K) | — | 23 |
| Maximum User I/O | — | 182 |
| Maximum I/O Pins in Package | — | 256-LFBGA / 256-UBGA |
| Temperatura de unión de funcionamiento | — | 0C to 85C (commercial) |
| Supply Voltage - Core (VCCINT) | — | 1.15 V to 1.25 V |
| Supply Voltage - I/O (VCCIO per bank) | — | 1.2 V to 3.3 V (bank-dependent) |
| Configuration Mode | — | Active Serial (AS), Passive Serial (PS), JTAG |