EP3C80F484C7N vs EP3C80F484I7N Comparación
Comparación detallada lado a lado de EP3C80F484C7N por Altera y EP3C80F484I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C80F484C7N | EP3C80F484I7N |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $306,54 | $286,91 |
| Product Type | FPGA - Field Programmable Gate Array | — |
| Series | Cyclone III | Cyclone III |
| Number of Logic Elements | 81264 LE | — |
| Number of User I/Os | 295 I/O | — |
| Embedded Memory | 2.68 Mbit | — |
| Maximum Internal Clock Frequency | 472.5 MHz | 472.5 MHz |
| Tensión de alimentación de funcionamiento | 1.15 V to 1.25 V | — |
| Minimum Operating Temperature | 0 C | — |
| Maximum Operating Temperature | +70 C | — |
| Encapsulado / Carcasa | 484-BGA (FBGA-484) | — |
| Package Dimensions | 23 x 23 mm, 2.60 mm height, 1.0 mm pitch | — |
| Estilo de montaje | SMD/SMT | — |
| Lead Finish | Lead-free (N suffix) | — |
| Number of PLLs | [DATA_NEEDED: Number of PLLs] | 4 |
| Number of 18x18 Multipliers | [DATA_NEEDED: Number of 18x18 multipliers] | 244 |
| Configuration Memory Requirement | External configuration device required | — |
| RoHS / Lead-free Label | Lead-free N ordering code | — |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Logic Elements | — | 81,264 |
| Embedded Memory (RAM bits) | — | 2,810,880 |
| User I/O Count | — | 295 |
| Number of Logic Blocks / CLBs | — | 81,264 |
| Core Supply Voltage VCCINT | — | 1.15 V to 1.25 V (nominal 1.2 V) |
| I/O Supply Voltage VCCIO | — | 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Process Technology | — | 60 nm low-power CMOS, SRAM-based |
| Operating Temperature (Junction) | — | -40C to +100C (industrial I7 grade) |
| Encapsulado | — | 484-ball FBGA, 23 x 23 mm, 1.0 mm pitch |
| Tipo de montaje | — | Surface Mount |
| Estado RoHS | — | Compliant |
| Lead-Free | — | Yes |
| Nivel MSL | — | 3 |
| Configuration Method | — | AS / PS / JTAG / FPP |