EP3CLS100F484C8N vs EP3C55F484C8N Comparación
Comparación detallada lado a lado de EP3CLS100F484C8N por Intel y EP3C55F484C8N por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3CLS100F484C8N | EP3C55F484C8N |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $115,40 | $58,50 |
| Series | Cyclone® III LS | — |
| Family Name | Cyclone III LS | — |
| Logic Elements | 100,448 | — |
| Embedded Memory Bits | 4,451,328 bits | 2,396,160 |
| Number of I/O | 278 (maximum user I/O) | — |
| Number of Logic Blocks / Cells | 47 (logic blocks reported by DigChip snapshot) | — |
| Package Type | FBGA-484 (FineLine BGA, lead-free) | — |
| Pin / Ball Count | 484 | — |
| Supply Voltage (Core) | 1.2 V | — |
| Speed Grade | C8 (commercial, fastest) | — |
| Process Technology | TSMC 65 nm low-power (LP) | — |
| Temperatura de funcionamiento | 0°C to +85°C (commercial grade) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Configuration Interface | JTAG, Passive Serial, Active Serial | — |
| Bitstream Encryption | AES-128 (Cyclone III LS security feature) | — |
| Estado RoHS | Compliant (Pb-free, 'N' suffix) | — |
| Nivel MSL | 3 (per JEDEC J-STD-020, typical for BGA) | — |
| Embedded Multipliers (18x18) | 4,488 (per Cyclone III LS family handbook, 100K LE tier) | 260 |
| PLLs | 4 (per Cyclone III LS family) | 4 |
| DSP Blocks | Integrated (multiplier-based) | — |
| Device Family | — | Cyclone III |
| Logic Elements (LE) | — | 55,856 |
| User I/O Pins | — | 327 |
| Memory Blocks (M9K) | — | 260 |
| Maximum Internal Frequency | — | 472 MHz |
| Core Voltage (VCCINT) | — | 1.2 V |
| Encapsulado | — | 484-BGA (FBGA), 23 x 23 mm, 1.0 mm pitch |
| Package Height | — | 2.60 mm |
| Operating Temperature (Commercial) | — | 0 C to +85 C |
| Process Node | — | 65 nm TSMC low-power |
| Configuration | — | SRAM-based, JTAG / AS / PS modes |
| Lead-Free / RoHS | — | Yes - lead-free, RoHS compliant |