EP3CLS100F484I7 vs EP3CLS100F484C7N Comparación
Comparación detallada lado a lado de EP3CLS100F484I7 por Intel y EP3CLS100F484C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3CLS100F484I7 | EP3CLS100F484C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $113,60 | $495,80 |
| Device Family | Cyclone III LS | — |
| Logic Elements (LE) | 100,448 | — |
| Logic Array Blocks (LABs) | 278 | — |
| Total Embedded Memory Bits | 4,451,328 bits | — |
| Embedded Memory (M9K Blocks) | 610 (per datasheet family) | — |
| DSP Blocks (18x18 Multipliers) | 66 | — |
| 18x18 Hardware Multipliers | 16 dedicated | — |
| PLLs | 4 | 4 |
| Maximum User I/Os | 429 | — |
| Encapsulado | 484-ball FBGA (FineLine BGA) | 484-ball FineLine BGA (FBGA-484) |
| Core Supply Voltage | 1.2 V | 1.2 V |
| I/O Standards Supported | LVDS, LVCMOS, LVTTL, SSTL, HSTL | — |
| Rango de temperatura de funcionamiento | -40C to +85C (Industrial) | — |
| Process Technology | TSMC 65 nm low-power (LP) | 65 nm low-power (TSMC) |
| Configuration Method | Serial/Parallel, AES-256 encrypted (LS feature) | SRAM-based (volatile), via EPCS/JTAG/parallel flash |
| External Memory Support | DDR, DDR2, QDRII, RLDRAM II | — |
| Estado RoHS | Compliant | Compliant (lead-free, N suffix) |
| Family | — | Cyclone III LS |
| Logic Elements | — | 100,448 |
| Embedded Memory (bits) | — | 4,451,328 |
| User I/O Pins | — | 278 |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: DSP block count] |
| Global Clock Networks | — | [DATA_NEEDED: global clock count] |
| Operating Temperature (junction) | — | 0°C to +85°C (commercial) |
| Speed Grade | — | C7 |
| Ball Pitch | — | 1.0 mm |
| Package Dimensions | — | [DATA_NEEDED: package body dimensions] |
| Security Features | — | Bitstream encryption, JTAG tamper protection |
| Tipo de montaje | — | Surface Mount |
| Design Software | — | Quartus II / Intel Quartus Prime |