EP3CLS150F484C8N vs EP3CLS150F484I7 Comparación
Comparación detallada lado a lado de EP3CLS150F484C8N por Intel y EP3CLS150F484I7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3CLS150F484C8N | EP3CLS150F484I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $115,20 | $101,10 |
| Family | Cyclone III LS | Cyclone III LS |
| Logic Elements (LE) | 150,848 | — |
| Total RAM Bits | 6,137,856 bits | — |
| Embedded Multipliers (18x18) | 210 | — |
| Logic Array Blocks (LABs) | 9,428 | — |
| PLLs | 4 | 4 |
| User I/O Pins | 226 (maximum) | — |
| Process Technology | 65 nm low-power | 60 nm low-power CMOS |
| Core Voltage (VCCINT) | 1.2 V | — |
| Encapsulado | 484-ball FBGA (FineLine BGA) | 484-ball FBGA (F484) |
| Speed Grade | 8 (commercial) | — |
| Maximum Operating Frequency | 402 MHz | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | -40C to +85C (Industrial) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Configuration Method | SRAM-based (external flash required) | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Logic Elements | — | 150,000 |
| Embedded Memory | — | 6,480 Kbits |
| DSP Blocks | — | 166 (18x18 multipliers) |
| Maximum User I/O | — | 226 |
| Ball Pitch | — | 1.0 mm |
| Supply Voltage (VCCINT) | — | 1.2 V |
| Configuration | — | AES-encrypted bitstream support (LS feature) |
| Nivel MSL | — | 3 |
| Security Feature | — | On-chip AES bitstream encryption |
| Programming Interface | — | JTAG / Active Serial / Passive Serial |