EP3CLS200F484C7N vs EP3CLS150F484C7N Comparación
Comparación detallada lado a lado de EP3CLS200F484C7N por Intel y EP3CLS150F484C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3CLS200F484C7N | EP3CLS150F484C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.650,00 | $102,75 |
| Series | Cyclone III LS | — |
| Logic Elements (LE) | 198,464 | 150,848 |
| Logic Array Blocks (LAB) | 12,404 | 9,428 |
| Embedded Memory | 8,211,456 bits | — |
| Embedded 18x18 Multipliers | 210 | — |
| User I/O | 226 | — |
| Encapsulado | 484-ball FBGA (FineLine BGA, 23x23 mm) | 484-pin FBGA (1.0 mm pitch) |
| Core Voltage | 1.2 V | 1.2 V |
| Temperatura de funcionamiento | 0C to +85C (commercial) | — |
| Process Technology | 65 nm low-power CMOS | 65 nm |
| Configuration Modes | AS, PS, JTAG (IEEE 1149.1) | — |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Number of I/O Banks | 8 | — |
| Hot Socketing | Supported | — |
| PLLs | 4 | 4 |
| Estado RoHS | Compliant | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Family | — | Cyclone III LS |
| Total Memory Bits | — | 6,137,856 |
| DSP Blocks | — | 210 |
| Maximum User I/O | — | 226 |
| Operating Temperature Grade | — | C (0 °C to 85 °C) |
| Maximum Internal Frequency | — | 437.5 MHz |
| Configuration Method | — | JTAG / Passive Serial / Active Serial |
| Bitstream Encryption | — | AES-128 supported |