EP3CLS200F484C7N vs EP3CLS200F484I7N Comparación
Comparación detallada lado a lado de EP3CLS200F484C7N por Intel y EP3CLS200F484I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3CLS200F484C7N | EP3CLS200F484I7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.650,00 | $198,00 |
| Series | Cyclone III LS | — |
| Logic Elements (LE) | 198,464 | — |
| Logic Array Blocks (LAB) | 12,404 | — |
| Embedded Memory | 8,211,456 bits | — |
| Embedded 18x18 Multipliers | 210 | — |
| User I/O | 226 | — |
| Encapsulado | 484-ball FBGA (FineLine BGA, 23x23 mm) | — |
| Core Voltage | 1.2 V | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | -40C to +100C (Industrial) |
| Process Technology | 65 nm low-power CMOS | 65 nm |
| Configuration Modes | AS, PS, JTAG (IEEE 1149.1) | — |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Number of I/O Banks | 8 | — |
| Hot Socketing | Supported | — |
| PLLs | 4 | — |
| Estado RoHS | Compliant | Compliant |
| Tipo de montaje | Surface Mount | Surface Mount |
| Device Family | — | Cyclone III LS |
| Logic Elements (LEs) | — | 198,464 |
| Embedded Memory Bits | — | 8,211,456 |
| Maximum User I/O | — | 210 |
| Maximum Operating Frequency | — | 437.5 MHz |
| Core Supply Voltage | — | 1.2 V |
| Package Type | — | FBGA-484 |
| Pin/Ball Count | — | 484 |
| Speed Grade | — | 7 |
| Configuration Scheme | — | FPGA (SRAM-based, external configuration) |
| Hardware Crypto Accelerator | — | Yes (AES, SHA - LS family feature) |