EP3CLS200F484C8 vs EP3CLS150F484C8N Comparación
Comparación detallada lado a lado de EP3CLS200F484C8 por Intel y EP3CLS150F484C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3CLS200F484C8 | EP3CLS150F484C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $118,00 | $115,20 |
| Series | Cyclone III LS | — |
| Family | Cyclone III LS (low-power Cyclone III) | Cyclone III LS |
| Logic Elements (LE) | 198,464 | 150,848 |
| Logic Array Blocks (LAB) | 20,5056 (approx) | — |
| Embedded Memory | 8,211,456 bits (approx 8 Mbit) | — |
| Embedded 18x18 Multipliers | 210 | — |
| PLLs | 4 | 4 |
| Maximum User I/O | 304 | — |
| I/O Banks | 8 | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 65 nm low-power CMOS | 65 nm low-power |
| Encapsulado | 484-pin FBGA (FineLine BGA) | 484-ball FBGA (FineLine BGA) |
| Package Dimensions | 23 mm x 23 mm, 1.0 mm ball pitch | — |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Security | Design encryption / bitstream AES | — |
| Temperatura de funcionamiento | 0C to +85C (commercial, 'C' suffix) | 0C to +85C (commercial) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Total RAM Bits | — | 6,137,856 bits |
| Embedded Multipliers (18x18) | — | 210 |
| Logic Array Blocks (LABs) | — | 9,428 |
| User I/O Pins | — | 226 (maximum) |
| Core Voltage (VCCINT) | — | 1.2 V |
| Speed Grade | — | 8 (commercial) |
| Maximum Operating Frequency | — | 402 MHz |
| Configuration Method | — | SRAM-based (external flash required) |
| Lead-Free | — | Yes |