EP3CLS200F484C8N vs EP3CLS150F484C8N Comparación
Comparación detallada lado a lado de EP3CLS200F484C8N por Intel y EP3CLS150F484C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3CLS200F484C8N | EP3CLS150F484C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.245,00 | $115,20 |
| Series | Cyclone III LS | — |
| Family | Cyclone® III LS | Cyclone III LS |
| Logic Elements | 198,464 | — |
| Embedded Memory | 8,211,456 bits (8.21 Mbit) | — |
| Logic Array Blocks (LABs) | [DATA_NEEDED: exact LAB count] | 9,428 |
| Embedded Multipliers (18x18) | 396 | 210 |
| User I/O Pins | 210 | 226 (maximum) |
| Number of PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 65 nm CMOS, low-leakage | 65 nm low-power |
| Maximum Operating Frequency | 402 MHz (fabric) | 402 MHz |
| Encapsulado | 484-ball FBGA (FineLine BGA), 23 x 23 mm | 484-ball FBGA (FineLine BGA) |
| Speed Grade | 8 (slowest) | 8 (commercial) |
| Temperature Grade | Commercial (0C to +85C TJ) | — |
| Bitstream Encryption | AES-128 (256-bit key via separate license) | — |
| Configuration Mode | Active Serial (AS), Active Parallel (AP), Passive Serial (PS), JTAG | — |
| Estado RoHS | Compliant | Compliant |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Logic Elements (LE) | — | 150,848 |
| Total RAM Bits | — | 6,137,856 bits |
| PLLs | — | 4 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Temperatura de funcionamiento | — | 0C to +85C (commercial) |
| Configuration Method | — | SRAM-based (external flash required) |
| Lead-Free | — | Yes |