EP3CLS70F780C7N vs EP3C55F780C7N Comparación
Comparación detallada lado a lado de EP3CLS70F780C7N por Intel y EP3C55F780C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3CLS70F780C7N | EP3C55F780C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $318,75 | $138,31 |
| Family | Cyclone III LS | Cyclone III |
| Logic Elements | 70,208 | 55,856 |
| Logic Array Blocks | 47,452 | — |
| Total Memory Bits | 3,068,928 bits | — |
| Embedded Multipliers (18x18) | 200 | — |
| Maximum User I/O | 413 | — |
| User I/O (this package) | 413 | — |
| Encapsulado | 780-ball FBGA (F780) | 780-ball FineLine BGA |
| Pins/Balls | 780 | — |
| Core Voltage | 1.2 V | — |
| Tensión de alimentación | 1.2 V | — |
| Process Node | 60 nm | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | 0C to +85C (commercial, C7 speed grade) |
| Transceivers | 0 (no high-speed transceivers) | — |
| Tipo de montaje | Surface Mount (BGA) | — |
| Estado RoHS | Compliant | Compliant |
| Embedded Memory | — | 2,396,160 bits (approximately 2.4 Mbit) |
| Embedded Memory Blocks | — | 312 M9K blocks |
| Embedded Multipliers | — | 156 (18 x 18) |
| User I/O Count | — | 377 |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Configuration Memory | — | 8 Kbits (supports PS, FPP, JTAG) |
| Process Technology | — | 65 nm low-power CMOS |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Bank Voltage (VCCIO) | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) |
| Speed Grade | — | 7 |