EP3CLS70F780C7N vs EP3CLS150F780C7N Comparación
Comparación detallada lado a lado de EP3CLS70F780C7N por Intel y EP3CLS150F780C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3CLS70F780C7N | EP3CLS150F780C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $318,75 | $88,40 |
| Family | Cyclone III LS | — |
| Logic Elements | 70,208 | — |
| Logic Array Blocks | 47,452 | — |
| Total Memory Bits | 3,068,928 bits | — |
| Embedded Multipliers (18x18) | 200 | 320 |
| Maximum User I/O | 413 | — |
| User I/O (this package) | 413 | — |
| Encapsulado | 780-ball FBGA (F780) | 780-ball FBGA (29x29 mm, 1.0 mm pitch) |
| Pins/Balls | 780 | — |
| Core Voltage | 1.2 V | — |
| Tensión de alimentación | 1.2 V | — |
| Process Node | 60 nm | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Transceivers | 0 (no high-speed transceivers) | — |
| Tipo de montaje | Surface Mount (BGA) | — |
| Estado RoHS | Compliant | Compliant |
| Device Family | — | Cyclone III LS |
| Logic Elements (LEs) | — | 150,848 |
| Logic Array Blocks (LABs) | — | 9,428 |
| Embedded Memory (M9K blocks) | — | 5,994 Kbits |
| Maximum User I/O Pins | — | 413 |
| Phase-Locked Loops (PLLs) | — | 4 |
| Process Technology | — | 65 nm CMOS |
| Core Supply Voltage | — | 1.2 V |
| Maximum Operating Frequency | — | 437.5 MHz |
| External Memory Interfaces | — | DDR2 SDRAM, QDRII+ SRAM |
| Speed Grade | — | C7 (commercial, -7 speed grade) |
| Configuration Methods | — | JTAG, Active Serial (AS), Passive Serial (PS) |