EP3SE110F780I4N vs EP3SE260H780I4LG Comparación
Comparación detallada lado a lado de EP3SE110F780I4N por Intel y EP3SE260H780I4LG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE110F780I4N | EP3SE260H780I4LG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.850,00 | $2.580,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III E | Stratix III Enhanced |
| Logic Elements | 107,500 | 255,000 LE |
| Embedded Memory Bits | 8,936,448 bits | — |
| Number of LABs/CLBs | 4300 | — |
| Number of Logic Elements / Cells | 107500 | — |
| Number of I/O | 488 | — |
| Encapsulado | 780-ball FCBGA (FineLine BGA) | 780-ball FineLine BGA (HBGA) |
| Package Code (JEDEC) | BGA, 780 pins | — |
| Tipo de montaje | Surface Mount | — |
| Temperatura de funcionamiento | -40C to +100C (industrial) | -40C to +100C |
| Speed Grade | 4 | -4 |
| Supply Voltage (VCCINT) | [DATA_NEEDED: VCCINT nominal] | — |
| Process Node | 40 nm | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | — |
| Lead Free | [DATA_NEEDED: lead-free status] | — |
| Family | — | EP3SE260 |
| Adaptive Logic Modules (ALMs) | — | 102,000 ALM |
| Embedded Memory | — | 15.90 Mbit |
| DSP Blocks | — | 304 |
| 18x18 Multipliers | — | 840 |
| User I/O | — | 488 |
| PLLs | — | 8 (4 fractional + 4 general-purpose) |
| Temperature Grade | — | Industrial (I) |
| Process Technology | — | 65 nm low-power CMOS |
| Configuration Method | — | JTAG / Passive Serial / Fast Passive Parallel / Active Serial |