EP3SE260F1152C4N vs EP3SE260F1152I3G Comparación
Comparación detallada lado a lado de EP3SE260F1152C4N por Intel y EP3SE260F1152I3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE260F1152C4N | EP3SE260F1152I3G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.620,00 | $1.240,00 |
| Series | Stratix III E | Stratix III E |
| Family | Stratix III (Enhanced) | Stratix III |
| Logic Elements (LEs) | 255,000 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| Maximum User I/Os | 744 | — |
| Number of LABs/CLBs | 10,200 | — |
| DSP / 18x18 Multipliers | 768 embedded multipliers | — |
| Process Technology | 65 nm CMOS | 40 nm TSMC low-power |
| Core Voltage | 1.1 V | — |
| Maximum Operating Frequency | 450 MHz | — |
| Encapsulado | 1152-ball FC-FBGA (flip-chip) | 1152-BBGA, FCBGA (FineLine BGA) |
| Speed Grade | -4 (commercial temperature) | I3 (Industrial, balanced) |
| Temperatura de funcionamiento | 0C to +85C (commercial, 'C' suffix) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Packaging | Tray | — |
| Lead-Free / RoHS | Lead-free finish (RoHS compliant per distributor listing) | — |
| Tipo de memoria | SRAM-based, volatile (requires configuration device) | — |
| Configuration | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP | — |
| Product Status | Obsolete (per Xecor cross-reference data) | — |
| Logic Elements (LE) | — | 255,000 |
| Embedded Memory Bits | — | 16,672,640 bits |
| Embedded Memory Bits (alternate) | — | 20,880 Kb (16,672,640 / 1024) |
| User I/O Count | — | 744 |
| Rango de temperatura de funcionamiento | — | -40C to +100C (Industrial) |
| Supply Voltage Core | — | 0.9 V (typical, see handbook) |
| Configuration Bitstream Encryption | — | AES-256 (Stratix III feature) |
| I/O Standards Supported | — | LVDS, LVPECL, HSTL, SSTL, LVCMOS, PCI, PCI-X |
| Estado RoHS | — | [DATA_NEEDED: RoHS compliance not stated in scraped data] |
| Nivel de sensibilidad a la humedad (MSL) | — | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] |
| Lead-Free Reflow | — | [DATA_NEEDED: peak reflow temperature] |
| Design Toolchain | — | Quartus II / Quartus Prime |
| Country of Origin / Distribution | — | Multiple authorized distributors (DigiKey, Mouser) |