EP3SE260F1517C3 vs EP3SL340F1517C3N Comparación
Comparación detallada lado a lado de EP3SE260F1517C3 por Intel y EP3SL340F1517C3N por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE260F1517C3 | EP3SL340F1517C3N |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $10.800,00 | $3.750,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 337,500 |
| Logic Array Blocks (LABs) | 10,200 | 13,500 |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/Os | 976 | — |
| DSP Blocks (18x18 multipliers) | 768 | — |
| PLLs | 12 | [DATA_NEEDED: PLL count] |
| Core Voltage | 0.9 V | — |
| Process Node | 65 nm (TSMC) | — |
| Encapsulado | 1517-BBGA, FCBGA (FineLine BGA) | 1517-ball FC-BGA |
| Package Pitch | 1.0 mm | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| Speed Grade | 3 | -3 (fastest commercial) |
| Configuration | SRAM-based, requires external configuration device | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (FC-BGA) |
| Estado RoHS | Compliant | Compliant (lead-free ball metallurgy, N suffix) |
| Family | — | Stratix III L |
| Embedded Memory Bits | — | 18,822,144 bits (18.8 Mbit) |
| Maximum User I/O Pins | — | 976 |
| Process Technology | — | 65 nm CMOS, low-power |
| Core Voltage (VCCINT) | — | 1.1 V |
| Maximum Core Frequency | — | 500 MHz |
| Package Code | — | F1517 |
| Temperatura de funcionamiento | — | 0 C to 85 C (commercial) |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |
| DSP Blocks | — | [DATA_NEEDED: exact DSP block count] |
| Transceivers | — | [DATA_NEEDED: transceiver count for this package] |