EP3SE260F1517C3N vs EP3SE260F1517C2G Comparación
Comparación detallada lado a lado de EP3SE260F1517C3N por Intel y EP3SE260F1517C2G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE260F1517C3N | EP3SE260F1517C2G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $9.850,00 | $2.050,00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 254,400 | 254,400 |
| Embedded Memory | 16,672,768 bits (16.7 Mbits) | — |
| User I/Os | 976 | — |
| DSP Blocks (18x18 Multipliers) | 816 | — |
| M9K Memory Blocks | 1,040 | — |
| Maximum Transceiver Data Rate | 600 Mbps | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | 20 |
| Encapsulado | 1517-BBGA (FCBGA) | 1517-ball FCBGA, 40x40 mm |
| Process Technology | 65 nm TSMC low-power CMOS | — |
| Speed Grade | C3 (commercial) | C2 (commercial, ~6 ns) |
| Temperatura de unión de funcionamiento | 0 C to +85 C (commercial) | — |
| Tipo de montaje | Surface Mount | — |
| Estado RoHS | Compliant | Compliant |
| External Memory Interfaces | DDR3, DDR2, QDRII+, RLDRAM2 | — |
| Adaptive Logic Modules (ALMs) | — | 81,760 |
| Total Memory Bits | — | 16,727,680 (16.67 Mbit) |
| Embedded Memory (M9K Blocks) | — | 864 |
| Embedded Multipliers (18x18) | — | 768 |
| User I/O Pins | — | 976 |
| Transceiver Channels | — | 12 |
| Transceiver Data Rate (max) | — | 3.75 Gbps (C2 grade) |
| PLLs (Fractional + Clock Multiplier) | — | 8 fractional + 4 CMU |
| Temperatura de funcionamiento | — | 0C to 85C (commercial, "C" suffix) |
| Process Node | — | 40 nm TSMC |
| Lead-Free / Halogen-Free | — | Yes / Yes |