EP3SE260F1517I4N vs EP3SE260F1517I4LN Comparación

Comparación detallada lado a lado de EP3SE260F1517I4N por Intel y EP3SE260F1517I4LN por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Intel
EP3SE260F1517I4N EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel

EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel

EP3SE260F1517I4N ⚠ Última compra
Intel
EP3SE260F1517I4LN EP3SE260F1517I4LN - 260K LE Stratix III E FPGA, 1517-FCBGA | Intel

EP3SE260F1517I4LN - 260K LE Stratix III E FPGA, 1517-FCBGA | Intel

EP3SE260F1517I4LN ⚠ Última compra

Comparación de especificaciones

Parámetro EP3SE260F1517I4N EP3SE260F1517I4LN
Marca Intel Intel
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida Última compra Última compra
Estado del stock In Stock In Stock
Precio unitario (USD) $10.500,00 $2.895,00
Series Stratix III E —
Logic Elements 255,000 255,000
Embedded Memory Bits 16,672,768 bits 16,672,768 bits (~2,044 KBytes)
Embedded Memory (M9K/M144K blocks) [DATA_NEEDED: total Kbits and block count] —
User I/O Pins 976 —
Transceivers [DATA_NEEDED: number of full-duplex channels] Stratix III E family supports up to 24 transceivers up to 8.5 Gbps
Transceiver Data Rate 600 Mbps to 6.375 Gbps —
DSP Blocks [DATA_NEEDED: number of 18x18 multipliers] —
PLLs [DATA_NEEDED: total PLL count] —
Core Voltage 1.1 V —
Process Technology TSMC 65 nm 40 nm CMOS
Encapsulado 1517-BBGA, FCBGA 1517-ball FCBGA (40 mm x 40 mm, 1.0 mm pitch)
Package Body Size [DATA_NEEDED: mm x mm] —
Temperatura de funcionamiento -40 °C to +100 °C (Industrial) -40C to +100C (case, industrial)
Operating Temperature Grade Industrial (I4) —
Tipo de montaje Surface Mount (BGA) —
Lead-Free / RoHS [DATA_NEEDED: explicit RoHS statement] Yes (N suffix)
Nivel MSL [DATA_NEEDED: MSL classification] —
Logic Array Blocks (LABs) — 10,200
User I/O Count — 976
Family — Stratix III E (Enhanced)
Speed Grade — I4 (industrial, 4th tier)
Power Option — L (low-power)
DSP Blocks (18x18 multipliers) — Up to 384 (family-level, device-specific count not in provided data)
Partial Reconfiguration — Supported
Memory Interface Support — DDR3, DDR2, QDR II+ (hardened PHY)
Configuration Scheme — Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG

Hojas de datos y recursos

Examinar todos los productos Crear BOM Solicitar cotización