EP3SE260H780C2 vs EP3SE260H780I4N Comparación
Comparación detallada lado a lado de EP3SE260H780C2 por Altera y EP3SE260H780I4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Altera
EP3SE260H780C2 - Stratix III E 260K LE FPGA | Altera | 780-BGA
EP3SE260H780C2 ⚠ Última compraIntel
EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel
EP3SE260H780I4N ⚠ Última compraComparación de especificaciones
| Parámetro | EP3SE260H780C2 | EP3SE260H780I4N |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.150,00 | $2.150,00 |
| Family | Stratix® III E | Stratix III Enhanced (Stratix III E) |
| Series | Stratix III | — |
| Logic Elements (LE) | 255,000 | — |
| Adaptive Logic Modules (ALM) | 102,000 | — |
| Embedded Memory (bits) | 16,672,768 | — |
| User I/Os | 488 | 488 |
| Number of LABs/CLBs | 10,200 | — |
| Process Node | 65 nm | — |
| Core Voltage | 0.86 V to 1.15 V | 1.1 V |
| Encapsulado | 780-BBGA, FCBGA | 780-pin FC-HFBGA (FCBGA) |
| Tipo de montaje | Surface Mount | — |
| Temperatura de funcionamiento | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Estado RoHS | Compliant | Compliant |
| Lead Free | Yes | — |
| Nivel MSL | 3 (per JEDEC J-STD-020) | — |
| Logic Elements | — | 255,000 |
| Embedded Memory Bits | — | 16,672,768 bits |
| Logic Array Blocks (LABs) | — | 10,200 |
| Process Technology | — | 65 nm |
| Maximum Operating Frequency | — | 450 MHz |
| Package Dimensions | — | 33 mm x 33 mm |
| Ball Pitch | — | [DATA_NEEDED: BGA ball pitch in mm] |
| Configuration Modes | — | AS, PS, JTAG, FPP |
| Boundary Scan | — | IEEE Std. 1149.1 (JTAG) |
| Lead-Free | — | Yes |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL rating] |